Multi-chip module integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

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Details

257691, 257723, 257787, H01L 2328

Patent

active

054518148

ABSTRACT:
A multi-chip module semiconductor device including a plurality of IC chips arranged in a side-by-side relationship on a supporting member such as a tab is provided. Each of the IC chips is provided with an array of bonding pads for connection with the exterior of the device only along such side to which no other IC chip is disposed adjacent thereto.

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