Multi-chip module inductor structure

Details Multi-chip module inductor structure Multi-chip module inductor structure

1995-06-08

1998-05-05

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257528, H01L 2900

Patent

active

057478708

ABSTRACT:
In a multichip module structure comprising a silicon, alumina or sapphire substrate carrying a plurality of layers of metallisation separated by polymer dielectric layers, with one or more inductors formed in the uppermost metallisation layer, a ferrite core for one of those inductors is located over the inductor and secured in position by flip chip solder bonding.

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patent: 5488542 (1996-01-01), Ito
patent: 5534837 (1996-07-01), Brandt

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