Multi chip module including semiconductor wafer or dice, interco

Details Multi chip module including semiconductor wafer or dice, interco Multi chip module including semiconductor wafer or dice, interco

1996-10-25

1998-09-01

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

G01R 102, H05K 302, H01L 2334

Patent

active

058014527

ABSTRACT:
An improved multi chip module (MCM) and a method for forming the multi chip module are provided. The multi chip module includes a semiconductor wafer and an interconnect substrate having contact members adapted to establish electrical communication with dice contained on the wafer. The contact members can be formed as etched pillars with penetrating projections or as microbumps on a flexible tape. An alignment plate associated with the interconnect substrate includes an alignment opening adapted to mechanically align bond pads, or other contact locations, on the wafer with the contact members on the interconnect substrate. The multi chip module also includes a force applying member in the form of a compressible bladder or elastomeric member, adapted to press the wafer against the interconnect substrate. In an alternate embodiment, the multi chip module includes tested singulated dice and the alignment plate includes multiple alignment openings.

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