Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2005-06-28
2005-06-28
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S723000, C257S777000
Reexamination Certificate
active
06911730
ABSTRACT:
The invention provides multi-chip modules (MCMs) that utilize transistors embedded in an active substrate to provide various desirable functions, optionally including programmable functions. In some embodiments, the MCM includes an active substrate having a field-programmable universal structure. The active substrate includes a regular grid pattern of lands separated by a programmable interconnect structure similar to those used in field programmable gate arrays (FPGAs). Interconnections within the programmable interconnect structure are controlled by values stored in configuration memory cells. The regular pattern of lands on the surface of the substrate permits the use of a single programmable active substrate to mount die of various sizes by means of solder bumps positioned to correspond to the land grid on the active substrate. The re-programmable nature of the interconnections within the substrate provide for the initial interconnections of the variously-sized die as well as providing for later alterations in the MCM design.
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Cartier Lois D.
Nguyen Cuong
Xilinx , Inc.
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