Multi-chip module having thermal contacts

Details Multi-chip module having thermal contacts Multi-chip module having thermal contacts

1993-11-15

1995-07-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174261, 257700, 361705, 361795, H05K 720

Patent

active

054326753

ABSTRACT:
A multi-chip module (MCM) having semiconductor chips on a top surface of multi-layered interconnection circuits formed on a planar surface of a substrate including: (a) multi-layered interconnection circuits comprising alternatively laminated interconnection layers with insulating layers, and thermal contacts, each of the thermal contacts comprising successively laminated interconnection layers on a bottom and on side-walls of a vertical hole penetrating a plurality of the insulating layers, and a thermal conductor filling the vertical hole on the successively laminated interconnection layers, and (b) a plurality of the semiconductor chips attached to the thermal conductor. In a preferred embodiment, a V-shaped vertical hole is formed in the insulating layers of polyimide for a thermal contact, copper films are successively laminated thereon, unpatterned copper and gold films are deposited thereon, and the entire surface of the metal film including the hole is coated by a silver-powder containing epoxy film, to which semiconductor chips are adhered.

REFERENCES:
patent: 4667401 (1987-05-01), Clements
patent: 4729061 (1988-03-01), Brown
patent: 4783695 (1988-11-01), Eichelberger
patent: 4963697 (1990-10-01), Peterson
patent: 5121299 (1992-06-01), Frankeny
patent: 5161093 (1992-11-01), Gorczyca
patent: 5227812 (1993-07-01), Watanabe

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