Multi chip module having self limiting contact members

Details Multi chip module having self limiting contact members Multi chip module having self limiting contact members

1996-08-02

1999-12-21

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257773, 257739, 257684, H01L 2334, H01L 2348, H01L 2306

Patent

active

060052902

ABSTRACT:
A method for forming a multi chip module for singulated semiconductor dice or dice contained on a wafer is provided. The method includes forming an interconnect adapted to support and establish an electrical connection with the dice. The interconnect includes a substrate formed of a material such as silicon with raised contact members. The raised contact members include projections adapted to penetrate contact locations on the dice (e.g., bond pads) to a limited penetration depth to establish the electrical connection. A conductive layer and conductive traces are formed on the substrate to form an electrical path to the contact members. Programmable links, such as fuses or anti-fuses, can be included in the electrical path for enabling or disabling select dice of the module. A packaged multi chip module assembly can be formed by encapsulation of the dice and substrate in an insulating material or by forming a ceramic base and cover.

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