Multi-chip module having interconnect dies

Details Multi-chip module having interconnect dies Multi-chip module having interconnect dies

1997-11-14

2000-01-18

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 257678, 257693, H05K 500, H01L 23053, H01L 23057

Patent

active

060162562

ABSTRACT:
A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

REFERENCES:
patent: 3676748 (1972-07-01), Kobayashi et al.
patent: 4167647 (1979-09-01), Salera
patent: 4423468 (1983-12-01), Gatto et al.
patent: 4437718 (1984-03-01), Selinko
patent: 4698663 (1987-10-01), Sugimoto et al.
patent: 4766479 (1988-08-01), Krum et al.
patent: 4931908 (1990-06-01), Boucard et al.
patent: 5081563 (1992-01-01), Feng et al.
patent: 5137456 (1992-08-01), Desai et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5220491 (1993-06-01), Sugano et al.
patent: 5281151 (1994-01-01), Arima et al.
patent: 5327325 (1994-07-01), Nicewarner, Jr.
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5403784 (1995-04-01), Hashemi et al.
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5473514 (1995-12-01), Nagano
patent: 5497027 (1996-03-01), Crafts
patent: 5625235 (1997-04-01), Takiar

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