Multi-chip module having content addressable memory

Details Multi-chip module having content addressable memory Multi-chip module having content addressable memory

2005-03-08

2005-03-08

Clark, S. V. (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S724000

Reexamination Certificate

active

06864122

ABSTRACT:
A monolithic Multi-chip Module (MCM) package includes two or more individual CAM dice mounted on a substrate formed as, for example, a plastic ball grid array (PBGA) package. The substrate includes an interconnect structure to route signals between corresponding pads of the CAM dice and balls of the MCM package. In some embodiments, the footprint of the MCM ball grid array package is identical to the footprint of a similar PBGA package housing a single CAM die. Each CAM die within the MCM package may be assigned the same device identification number (DID).

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Patent Abstracts of Japan Publication No. 08273376 entitled “Associative Memory System” and published Nov. 18, 1996.

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