Multi-chip module having an integral capacitor element

Details Multi-chip module having an integral capacitor element Multi-chip module having an integral capacitor element

1998-04-28

2000-05-09

Kincaid, Kristine

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361361, 361311, H01G 4228, H01G 406

Patent

active

060612282

ABSTRACT:
A multi-chip module has an integral capacitor element embedded within the substrate and includes a plurality of substrate layers forming a multi-chip module substrate. The substrate has a cut edge and forms at the cut edge a bondable edge. A via is formed in the substrate, and a dielectric capacitive material fills the via for a plurality of substrate layers and defines a multilayer capacitor. The multilayer capacitor and via are positioned at the bondable edge and connects to the bondable edge. In one aspect, the via having the dielectric capacitive material is positioned at the cut edge, and includes a conductive material filling at least a portion of the cut via to form the bondable edge. The dielectric capacitive material and bondable edge form a junction surface. A signal trace can be formed on a substrate layer and connected to the capacitor to form a DC blocking capacitor structure. A ground line can be formed on one substrate layer and engage the capacitive material. A signal trace can be formed on one of the substrate layers and engage the bondable edge to define a decoupling capacitor structure.

REFERENCES:
patent: 4622619 (1986-11-01), Schilling et al.
patent: 4771362 (1988-09-01), Behn
patent: 5134539 (1992-07-01), Tuckerman et al.
patent: 5160907 (1992-11-01), Nakajima et al.
patent: 5384434 (1995-01-01), Mandei et al.
patent: 5583739 (1996-12-01), Yu et al.
patent: 5625528 (1997-04-01), Devoe et al.
patent: 5811868 (1998-09-01), Bertin et al.

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