Multi-chip module having a multi-layer circuit board with insula

Details Multi-chip module having a multi-layer circuit board with insula Multi-chip module having a multi-layer circuit board with insula

1995-12-15

1996-12-17

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 361789, 361792, H05K 720

Patent

active

055860060

ABSTRACT:
A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.

REFERENCES:
patent: 4389862 (1983-06-01), Hastings
patent: 4982311 (1991-01-01), Dehaine
patent: 5045922 (1991-09-01), Kodama
patent: 5130768 (1992-07-01), Wu
patent: 5155661 (1992-10-01), Nagesh
patent: 5256469 (1993-10-01), Cherukuri
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patent: 5306670 (1994-04-01), Mowatt
patent: 5432679 (1995-07-01), Grabbe
patent: 5483101 (1996-01-01), Shimoto
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12, No. 4, Dec. 1989, New York US, pp. 658-662; S. Sasaki et al. `A New Multichip Module Using a Copper Polyimide Multilayer Substrate`.
Research Disclosure, No. 326, Jun. 1991, Havant GB p. 401, `Low Profile Chip Package`.
1992 IEEE Multi-Chip Module Conference, MCMC-92, Mar. 18-20, 1992, Santa Cruz, California, USA, pp. 8-11, T. Sudo.: "Silicon-On-Silicon Technology for CMOS-Based Computer Systems", figure 4.

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