Multi-chip module for battery power control

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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C438S124000, C438S106000, C257S666000, C257S676000, C257S670000, C257S675000, C257SE23031, C257SE23059, C257S733000, C257S787000, C257S796000, C257SE23001

Reexamination Certificate

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08003447

ABSTRACT:
A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.

REFERENCES:
patent: 7145224 (2006-12-01), Kawashima et al.
patent: 2004/0262720 (2004-12-01), Satou et al.
patent: 2007/0132075 (2007-06-01), Masumoto

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