Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-08-23
2011-08-23
Fahmy, Wael M (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C438S106000, C257S666000, C257S676000, C257S670000, C257S675000, C257SE23031, C257SE23059, C257S733000, C257S787000, C257S796000, C257SE23001
Reexamination Certificate
active
08003447
ABSTRACT:
A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
REFERENCES:
patent: 7145224 (2006-12-01), Kawashima et al.
patent: 2004/0262720 (2004-12-01), Satou et al.
patent: 2007/0132075 (2007-06-01), Masumoto
Dosdos Bigildis
Lee Edwin Man Fai
Lee Jeongil
Lee Myoungho
Lim David Chong Sook
Armand Marc
Fahmy Wael M
Fairchild Semiconductor Corporation
Kilpatrick Townsend & Stockton LLP
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