Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2011-01-11
2011-01-11
Fahmy, Wael M (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257S677000, C257S670000, C257S675000, C257SE23031, C257SE23059, C257S733000, C257S787000, C257S796000, C257SE23194, C257SE23001
Reexamination Certificate
active
07868432
ABSTRACT:
A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
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Dosdos Bigildis
Edwin Lee Man Fai
Lee Jeongil
Lee Myoungho
Lim David Chong Sook
Armand Marc
Fahmy Wael M
Fairchild Semiconductor Corporation
Townsend and Townsend / and Crew LLP
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