Multi-chip module cooling

Details Multi-chip module cooling Multi-chip module cooling

1989-11-28

1991-03-19

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361381, 361383, 165 803, 357 81, H01L 2504, H02B 120, H02B 100, H05K 720

Patent

active

050015486

ABSTRACT:
There is disclosed a liquid cooled multi-chip semi-conductor module comprising multiple semi-conductor devices each having one surface prepared with electrical interconnect means for mechanical and electrical attachment to an electrical interconnect substrate, said semi-conductor device having a surface opposing said surface prepared with said electrical interconnect means, said opposing surface being a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, one surface of said conduit having apertures corresponding in placement and geometry to said heat transfer surfaces of said semi-conductor devices mounted on said electrical interconnect means wherein said heat transfer surfaces and said conduit surface containing said apertures are approximately coincident thereby providing an approximately hydraulically smooth surface for the flow of coolant thereby minimizing undesirable flow characteristics such as cavitation and vortex shedding.

REFERENCES:
patent: 4712158 (1957-12-01), Kikachi et al.
patent: 4712609 (1987-12-01), Iversen
patent: 4799543 (1989-01-01), Iversen

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