Multi-chip module and production method thereof

Details Multi-chip module and production method thereof Multi-chip module and production method thereof

1996-07-03

1998-10-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361816, 361818, 361728, 361736, 361746, 361783, 361777, 361793, 361767, 361807, 361810, 361812, 257686, 257704, 257668, 257666, 257685, 257353, 257724, 257723, 257786, 257700, 439 69, H05K 118, H01L 2500

Patent

active

058186999

ABSTRACT:
An approximately lead-free mounting pad is formed on a first surface of a substrate having wiring circuits, and an electronic element having an approximately lead-free electrode is face-down mounted on the first surface. An approximately lead-free bump is formed on the approximately lead-free electrode of an electronic element. Mounting pads and approximately lead-free bumps are electrically and mechanically connected to each other by approximately lead-free conductive resin. An approximately lead-free sealing pattern is formed at the area which encloses the electronic element mounted area, of the first surface of the substrate. A weld ring made of Kovar is brazed onto the sealing pattern with approximately lead-free solder. The opening edge of a sealing cap made of Kovar disposed opposite to the weld ring and the weld ring are bonded at the deposited zone by welding.

REFERENCES:
patent: 5153709 (1992-10-01), Fukuoka
patent: 5414300 (1995-05-01), Tozawa et al.
patent: 5473512 (1995-12-01), Degani et al.
patent: 5477009 (1995-12-01), Brendecke et al.
patent: 5639989 (1997-06-01), Higgins, III

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