Multi-chip module and method of manufacture

Details Multi-chip module and method of manufacture Multi-chip module and method of manufacture

2007-01-16

2007-01-16

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE29132

Reexamination Certificate

active

11116571

ABSTRACT:
A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension than the first semiconductor chip. A spacer is coupled to the second semiconductor chip. Bonding pads on the first and second semiconductor chips are wirebonded to bonding pads on the support substrate. A third semiconductor chip is mounted to the spacer and bonding pads on the third semiconductor chip are wirebonded to bonding pads on the support substrate.

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