Multi-chip module

Details Multi-chip module Multi-chip module

2011-01-18

2011-01-18

Fahmy, Wael M (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE23180, C257SE21505, C257S777000, C257S784000, C257S678000, C257S666000, C438S107000

Reexamination Certificate

active

07872350

ABSTRACT:
A multi-chip module includes at least one integrated circuit chip that is electrically connected to first external terminals of the multi-chip module and at least one power semiconductor chip that is electrically connected to second external terminals of the multi-chip module. All first external terminals of the multi-chip module are arranged in a contiguous region of an terminal area of the multi-chip module.

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Engl, M., et al., “mm-Wave Packaging: A Low-cost Solution based on a Leadless Plastic Package,” 8 pages.

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