Multi chip module

Details Multi chip module Multi chip module

2006-11-27

2010-02-02

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S784000, C257S723000

Reexamination Certificate

active

07656039

ABSTRACT:
The present invention provides a multi chip module which realizes high functions or high performances thereof. A multi chip module is constituted by stacking a first semiconductor chip on which a digital signal processing circuit is mounted, a second semiconductor chip which constitutes a dynamic random access memory, a third semiconductor chip which constitutes a non-volatile memory, and a mounting substrate thus forming the stacked structure. The first semiconductor chip is arranged on an uppermost layer with a spacer interposed on a back surface side thereof. The second semiconductor chip is arranged on the mounting substrate.

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