Multi-chip light emitting diode package

Details Multi-chip light emitting diode package Multi-chip light emitting diode package

2005-02-22

2005-02-22

Dang, Phuc T. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

C257S099000

Reexamination Certificate

active

06858870

ABSTRACT:
A multi-chip light emitting diode (LED) package includes red, green, and blue LED chips directly bonded on a silicon substrate for a controlling integrated circuit (IC), and a carrier to which the controlling IC is attached. The multi-chip LED package has reduced volume and enhanced heat-radiating power. The chips are directly driven and controlled by the controlling IC, so that the carrier is not necessarily a printed circuit board but may be made of any solid material.

REFERENCES:
patent: 4985753 (1991-01-01), Fujioka et al.
patent: 5345373 (1994-09-01), Tanida

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