Multi-chip land grid array carrier

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361762, 361763, 361764, 361765, 361766, 361767, 257782, 257780, 257773, 257737, 174 163, 439 68, 439 69, H05K 118

Patent

active

059911611

ABSTRACT:
A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.

REFERENCES:
patent: 4074342 (1978-02-01), Honn et al.
patent: 5313366 (1994-05-01), Gaudenzi et al.
patent: 5598033 (1997-01-01), Behlen et al.
patent: 5703753 (1997-12-01), Mok

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