Multi-chip integrated circuit module

Details Multi-chip integrated circuit module Multi-chip integrated circuit module

1994-01-11

1995-07-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 257724, 361764, 361795, H05K 720

Patent

active

054326770

ABSTRACT:
A multi-chip integrated circuit module includes a supporting layer of laminate material over which a high-density interconnect structure is formed. The laminate layer includes a first upper laminate layer (10) having a hole (14) disposed therein for receiving an integrated circuit chip die (56). A lower core laminate layer (16) having a conductive layer (18) and conductive layer (20) disposed on opposite sides thereof is laminated to the lower surface of the layer (10). Plated-through holes (36), (38) and (40) are formed through the two layers (10) and (16) to connect the conductive layer (20) with a conductive layer (12) on the upper surface of the layer (10). A high-density interconnect layer includes two laminate layers (126) and (138), each having vias formed therethrough and via interconnect structures disposed on the surfaces thereof. The via interconnect structures in the layer (126) allow for connections from the die (56) to the conductive layer (12). The via interconnect structures formed in the layer (138) allow interconnection from the upper surface of layer (138) to via interconnects formed in the layer (126). An I/O connector is interfaced with select ones of the plated-through holes with pins (162) and (164). This allows an interface from the module to an operating system through pins (166).

REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 5108825 (1992-04-01), Wojnarowski
patent: 5157589 (1992-10-01), Cole, Jr.
patent: 5161093 (1992-11-01), Gorczyca
patent: 5280414 (1994-01-01), Davis
patent: 5306670 (1994-04-01), Mowatt

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