Multi-chip electronic package module utilizing an adhesive sheet

Details Multi-chip electronic package module utilizing an adhesive sheet Multi-chip electronic package module utilizing an adhesive sheet

1993-11-16

1994-11-01

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

H01L 2302

Patent

active

053609425

ABSTRACT:
There is provided a module for supporting a plurality of semiconductor devices within an electronic package. The module has a support substrate and an apertured substrate laminated together with a polymer adhesive. A plurality of semiconductor devices are disposed within apertures formed in the apertured substrate and bonded to the support substrate by that same polymer adhesive.

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