Multi-chip electrically reconfigurable module with predominantly

Details Multi-chip electrically reconfigurable module with predominantly Multi-chip electrically reconfigurable module with predominantly

1995-12-07

1997-12-30

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361728, 361785, H05K 702

Patent

active

057037590

ABSTRACT:
An electrically reconfigurable multi-chip module (MCERD) comprises three electrically reconfigurable integrated circuits (ERICs) enclosed in a package. The package provides for more "extra-package" connections between the ERICs and package pins than it does "intra-package" inter-chip connections. However, configuration connections between ERICs are intra-package. The MCERD is mounted on a daughterboard which provides connections between package pins and between package pins and pins of the daughterboard. The connections between package pins define "extra-package inter-chip" connections that typically far exceed the number of intra-package inter-chip connections. The connections between package pins and daughterboard pins connect the MCERD to a host system when the daughterboard is mounted on the host system motherboard. When the MCERD and daughterboard are installed in a host system, the MCERD can be electrically configured and then operated as configured. A feature of this MCERD is that a system developer can configure the inter-chip connections by appropriate design of the daughterboard.

REFERENCES:
patent: 3648116 (1972-03-01), Baugher et al.
patent: 4727268 (1988-02-01), Hori
patent: 5539621 (1996-07-01), Kikinis
"EPF8050M ASIC Prototyping Vehicle", Altera Corporation, San Jose, California, Jan. 1994, two pages.

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