Multi-chip device and method for producing a multi-chip device

Details Multi-chip device and method for producing a multi-chip device Multi-chip device and method for producing a multi-chip device

2007-11-20

2007-11-20

Mis, David (Department: 2817)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S777000

Reexamination Certificate

active

11155277

ABSTRACT:
The present invention relates to a multi-chip device comprising a plurality of chip stacks each including a plurality of single chips stacked on each other, wherein the stacked single chips are electrically interconnected by one or more through-chip-connection extending through at least one of the single chips and a substrate providing one or more first contact elements each of which is in contact with one of the through-chip-connections and providing one or more second contact elements being in electrical contact with the first contact elements, wherein the plurality of chip stacks are stacked onto each other and wherein the second contact elements of one of the chip stacks each being arranged to be in contact to one or more third contact elements of an adjacent one of the chip stacks.

REFERENCES:
patent: 2005/0051883 (2005-03-01), Fukazawa
patent: 2006/0195734 (2006-08-01), Shibata et al.

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