Multi-chip cooling module and method

Details Multi-chip cooling module and method Multi-chip cooling module and method

1993-07-06

1995-01-10

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 174 17LF, 174 17CT, 257714, H05K 100

Patent

active

053809564

ABSTRACT:
A liquid cooling module for semiconductor chips is disclosed. The module includes a plurality of substrates, each containing at least one chip. The substrates are arranged in the module so that when coolant flows through the module, the coolant is exposed to the top and bottom surfaces of the chips. A gasket is used between each substrate. The gasket is made if a Z-axis elastromeric material that is impervious to liquid and therefore directs the flow of the coolant in the module and makes the module liquid tight. The material also is conductive in the Z direction, but not the X or Y direction, thereby making electrical communication between the chips on different substrate levels possible. The module is intended to be attached to a circuit board, thus simplifying the layout of liquid cooled chips on the board.

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patent: 5280192 (1994-01-01), Kryzaniwsky

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