Multi-chip ceramic module for mounting electric parts on both su

Details Multi-chip ceramic module for mounting electric parts on both su Multi-chip ceramic module for mounting electric parts on both su

1995-09-29

1997-05-27

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 257700, 257713, 257723, 361715, 361744, 361774, 361791, H05K 720

Patent

active

056337833

ABSTRACT:
Multi-layer wiring structures are respectively formed in upper and lower ceramic substrates for electric parts, and interconnecting pins held in contact with contact pads establish electrical connections between the multi-layer wiring structures so as to prevent a multi-chip module from an undesirable disconnection between the multi-layer wiring structures.

REFERENCES:
patent: 4724472 (1988-02-01), Susimoto et al.
patent: 5043794 (1991-08-01), Tai et al.
patent: 5199164 (1993-04-01), Kim et al.
patent: 5444296 (1995-08-01), Kaal et al.

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