Multi-chemistry plating system

Details Multi-chemistry plating system Multi-chemistry plating system

2007-05-29

2007-05-29

King, Hoy (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S228800, C204S275100, C205S157000, C205S191000, C134S026000, C134S148000, C134S151000, C134S153000

Reexamination Certificate

active

10616284

ABSTRACT:
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

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