Heat exchange – With timer – programmer – time delay – or condition responsive... – Having heating and cooling capability
Reexamination Certificate
2007-06-05
2007-06-05
Ciric, Ljiljana (Department: 3753)
Heat exchange
With timer, programmer, time delay, or condition responsive...
Having heating and cooling capability
C165S264000, C165S263000, C062S209000, C156S345420
Reexamination Certificate
active
09828029
ABSTRACT:
A temperature control system for a semiconductor processing facility includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules that separately control temperatures of multiple process components. The temperature control modules are near process components and include a circulation loop for cooling fluid from the common cooling unit and a circulation loop for a heat transfer fluid received from a component. A heat exchanger within the temperature control module allows heat transfer between heat transfer fluid and cooling fluid, thereby cooling the component. A heat source may also be within the temperature control module to heat the heat transfer fluid and the component. The cooling unit may be a refrigeration unit that provides compressed refrigerant to the temperature control modules which may include an upstream thermal expansion valve and a downstream refrigerant flow control valve that form an evaporation chamber.
REFERENCES:
patent: 3735805 (1973-05-01), Stillhard
patent: 5201187 (1993-04-01), Yoshikawa
patent: 5269146 (1993-12-01), Kerner
patent: 5348076 (1994-09-01), Asakawa
patent: 5413164 (1995-05-01), Teshima et al.
patent: 5535818 (1996-07-01), Fujisaki et al.
patent: 5579826 (1996-12-01), Hamilton et al.
patent: 5607009 (1997-03-01), Turner et al.
patent: 5613364 (1997-03-01), Higgins
patent: 5794450 (1998-08-01), Alexander
patent: 5802856 (1998-09-01), Schaper et al.
patent: 5823005 (1998-10-01), Alexander et al.
patent: 6015465 (2000-01-01), Kholodenko et al.
patent: 6026896 (2000-02-01), Hunter
patent: 6091060 (2000-07-01), Getchel et al.
patent: 6102113 (2000-08-01), Cowans
patent: 6209334 (2001-04-01), Cowans et al.
patent: 6308776 (2001-10-01), Sloan et al.
patent: 6345515 (2002-02-01), Pautsch et al.
patent: 6389225 (2002-05-01), Malinoski et al.
Ciric Ljiljana
McKenna Long & Aldridge LLP
Oriol Inc.
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