Multi-chamber wafer process equipment having plural, physically

Details Multi-chamber wafer process equipment having plural, physically Multi-chamber wafer process equipment having plural, physically

1992-01-09

1994-02-15

Chaudhuri, Olik

Coating apparatus

Gas or vapor deposition

Multizone chamber

118729, 20429825, 20429826, 20429835, 414217, 414225, 437925, C23C 1600, A61K 2702

Patent

active

052862968

ABSTRACT:
In a multi-chamber process equipment in which a plurality of process chambers for processing a single wafer are connected with a wafer transfer chamber in parallel through respective gate valves, and a wafer transfer means is provided for carrying the wafer between the wafer transfer chamber and each process chamber through one of the gate valves, there are further provided a plurality of vacuum pumps in order to prevent cross contamination among processes, improve throughput and prevent condensation in the process chambers. The vacuum pumps are connected with the wafer transfer chamber, and designed to reduce the pressure in the wafer transfer chamber to different vacuum levels. Therefore, the degree of vacuum in the wafer transfer chamber can be set at a desired value according to the process chamber to be opened, by operating the vacuum pumps properly, so that cross contamination between the wafer transfer chamber and the process chambers is prevented effectively.

REFERENCES:
patent: 4473455 (1984-09-01), Dean et al.
patent: 4498416 (1985-02-01), Bouchaib
patent: 4605469 (1986-08-01), Shih et al.
patent: 4643627 (1987-02-01), Bednorz et al.
patent: 4664062 (1987-05-01), Kamohara et al.
patent: 4715921 (1987-12-01), Maher et al.
patent: 4810473 (1989-03-01), Tamura et al.
patent: 4818327 (1989-04-01), Davis et al.
patent: 4923584 (1990-05-01), Bramhall, Jr. et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5067218 (1991-11-01), Williams
patent: 5076205 (1991-12-01), Vowles et al.
patent: 5100502 (1992-03-01), Murdoch et al.

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