Multi-chamber sputtering apparatus

Details Multi-chamber sputtering apparatus Multi-chamber sputtering apparatus

1996-02-27

1998-07-21

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429815, 20429823, 20429825, 20429826, 20429827, 20429828, 20429829, C23C 1456

Patent

active

057830550

ABSTRACT:
A multi-chamber sputtering apparatus characterized in that a plurality of target electrodes and a substrate transfer mechanism which is able to transfer a substrate to positions facing the target electrodes and change distance between the target electrodes and the substrate.

REFERENCES:
patent: 4465416 (1984-08-01), Burkhalter et al.
patent: 4664935 (1987-05-01), Strahl
patent: 4674621 (1987-06-01), Takahsahi
patent: 4951601 (1990-08-01), Maydan et al.

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