Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1997-06-06
2000-04-25
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257532, 257676, 257916, 257724, 257659, 3613062, H01G 114, H01L 2302, H01L 2312, H01L 2500
Patent
active
060547545
ABSTRACT:
A packaged integrated circuit device with a multi-level lead frame has a plurality of integral capacitors formed by placing a thin dielectric layer between a lower lead frame and an upper lead frame, one of the lead frames being subdivided into a plurality of portions, each subdivided portion with an accessible tab for wire attachment. The planar capacitors are bonded to the bottom surface of the chip and act as a die support paddle. Each capacitor may be configured to provide the desired voltage decoupling and noise suppression for a particular portion of the integrated circuit to which it is connected. Capacitors useful for other purposes may be likewise provided in the package.
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Hyperquad Series Type 5, Three Metal layer QFP (TM) QFP), 2 pages.
English translation of Japanese Patent No. 4188759.
Micro)n Technology, Inc.
Williams Alexander Oscar
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