Multi-barrel die transfer apparatus and method for...

Details Multi-barrel die transfer apparatus and method for... Multi-barrel die transfer apparatus and method for...

2005-07-12

2005-07-12

Hong, John C. (Department: 3726)

Metal working

Method of mechanical manufacture

Assembling or joining

C029S428000, C029S600000, C029S729000, C029S740000, C029S759000, C029S743000

Reexamination Certificate

active

06915551

ABSTRACT:
A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.

REFERENCES:
patent: 4346514 (1982-08-01), Makizawa et al.
patent: 6731353 (2004-05-01), Credelle et al.
patent: 2003/0136503 (2003-07-01), Green et al.
patent: 2003/0211652 (2003-11-01), Summers
patent: 405013990 (1993-01-01), None
Copy of International Search Report for Application No. PCT/US03/23792, mailed Jan. 12, 2004 (4 pages).

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