Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1998-02-17
2000-12-26
Ryan, Patrick
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
228 37, 228260, B23K 108, B23K 3102
Patent
active
06164515&
ABSTRACT:
A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The debridging tool, which comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board, targets only those areas of the board where bridges or excess solder repeatedly forms during the soldering process without disturbing solder joints where no bridges or excess solder form. More than one movable nozzle may be used where warranted. Since the debridging tool is positioned so closely to the wave soldering station and the latent heat from the soldering process remains in the printed circuit board, and the gas mass is relatively small, the stream of air, gas or other fluid used for solder removal may be kept below the temperature of molten solder. The debridging tool also permits the stream to be emitted at a first pressure under a first area where solder is to be removed and at a second pressure under a second area where solder is to be removed.
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International Preliminary Examining Authority, PCT Written Opinion, Nov. 16, 1999.
International Preliminary Examination Report, Apr. 20, 2000.
Andrus James J.
Larrabee Allan Lance
Norton John
Willemen Lambertus P.
Ryan Patrick
Soltec B.V.
Stoner Kiley
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