Electricity: electrical systems and devices – Miscellaneous
Patent
1984-05-29
1987-02-03
Kucia, R. R.
Electricity: electrical systems and devices
Miscellaneous
174 685, 361406, H05K 118
Patent
active
046412220
ABSTRACT:
An improved mounting system for surface mounted components is described. The mounting system of the present invention provides preparations for surface mounted components and the printed circuit substrate which render the resultant assembly highly resistant to stresses which occur due to thermal cycling. The printed circuit substrate is conditioned by removing selected areas of media surrounding the points of attachment between the surface mounted component and the printed circuit media. In addition, a spacing element is disposed between the surface mounted component and the printed circuit media to promote the formation of a virtual lead during assembly.
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Corning, Corning Fotoceram Grid Boards, pamphlet describing kit form.
Derfiny Dennis J.
Edguer Nihat S.
Van den Heuvel Anthony P.
Jacobson, Jr. James E.
Kucia R. R.
Motorola Inc.
Roney Edward M.
Southard Donald B.
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