Metal working – Barrier layer or semiconductor device making
Reexamination Certificate
2006-03-13
2009-11-24
Booth, Richard A. (Department: 2812)
Metal working
Barrier layer or semiconductor device making
C438S106000
Reexamination Certificate
active
07621969
ABSTRACT:
A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted. The substrate can be sustained at a desirable temperature over the substantially entire mounting process having a series of steps, and in particular, occurrence of problems ascribed to moisture absorption can be suppressed or prevented.
REFERENCES:
patent: 6197612 (2001-03-01), Watanabe
patent: 6230719 (2001-05-01), Wensel
patent: 2003/0150108 (2003-08-01), Higashi et al.
patent: 5-315400 (1993-11-01), None
patent: 11-126796 (1999-05-01), None
patent: 2002-350871 (2002-12-01), None
patent: 2003-017534 (2003-01-01), None
patent: 2004-303323 (2004-10-01), None
Masumoto Mutsumi
Terada Katsumi
Booth Richard A.
Smith Patent Office
Toray Engineering Co., Ltd.
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