Mounting substrate and electronic apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

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Details

C257S786000

Reexamination Certificate

active

07939951

ABSTRACT:
A mounting substrate having a structure allowing reduction of the cost and an electronic apparatus formed by surface-mounting a semiconductor device thereon are provided. The mounting substrate is a mounting substrate mounted with a semiconductor device having external terminals alignedly arrayed in the form of a matrix, and includes junctions arrayed on a surface to which the semiconductor device is opposed so that the external terminals are bonded thereto respectively and wires connected to the junctions respectively and extracted out of a region to which the semiconductor device is bonded. The wires connected to inwardly arrayed 4 rows byncolumns (n: integer of not less than 5) of the junctions respectively are formed on a first wiring layer. The wires connected to the junctions set in two annular arrays surrounding the outer sides of the 4 rows byncolumns of junctions respectively are formed on a second wiring layer different from the first wiring layer.

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patent: 2006-066753 (2006-03-01), None

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