Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2011-05-10
2011-05-10
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S786000
Reexamination Certificate
active
07939951
ABSTRACT:
A mounting substrate having a structure allowing reduction of the cost and an electronic apparatus formed by surface-mounting a semiconductor device thereon are provided. The mounting substrate is a mounting substrate mounted with a semiconductor device having external terminals alignedly arrayed in the form of a matrix, and includes junctions arrayed on a surface to which the semiconductor device is opposed so that the external terminals are bonded thereto respectively and wires connected to the junctions respectively and extracted out of a region to which the semiconductor device is bonded. The wires connected to inwardly arrayed 4 rows byncolumns (n: integer of not less than 5) of the junctions respectively are formed on a first wiring layer. The wires connected to the junctions set in two annular arrays surrounding the outer sides of the 4 rows byncolumns of junctions respectively are formed on a second wiring layer different from the first wiring layer.
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Clark S. V
Rabin & Berdo PC
Rohm & Co., Ltd.
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