Mounting structure of semiconductor device and mounting...

Details Mounting structure of semiconductor device and mounting... Mounting structure of semiconductor device and mounting...

2005-10-25

2005-10-25

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S125000, C438S126000, C438S127000, C438S108000, C438S613000, C438S411000

Reexamination Certificate

active

06958262

ABSTRACT:
An insulating sheet which connects a semiconductor chip and a wiring substrate is provided between the semiconductor chip and the wiring substrate. The insulating sheet has windows therethrough at positions corresponding to those of connection pads of the wiring substrate and has leads, one end of each of the leads being fixed on the sheet and the other end of each of the leads protruding from the opposite surface of the sheet through a window. Each of solder balls of the semiconductor chip is connected to the fixed one end of one of the leads, and each of the connection pads is connected to the other end of each of the leads to electrically connect the semiconductor chip and the wiring substrate.

REFERENCES:
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5440452 (1995-08-01), Kitahara et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 6342726 (2002-01-01), Miyazaki et al.
patent: 62-67829 (1987-03-01), None
patent: 5-206216 (1993-08-01), None
patent: 9-289226 (1997-11-01), None
patent: 10-229147 (1998-08-01), None
patent: 10-284635 (1998-10-01), None
patent: 2000-133749 (2000-05-01), None

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