Mounting structure of semiconductor chip, semiconductor...

Details Mounting structure of semiconductor chip, semiconductor... Mounting structure of semiconductor chip, semiconductor...

2007-10-23

2007-10-23

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C257S783000, C257S792000

Reexamination Certificate

active

11065070

ABSTRACT:
The present invention provides a mounting structure of a semiconductor chip (3) onto an insulated substrate (2). The insulated substrate (2) is made of a polyimide resin, at least side surfaces (3c) of the semiconductor chip (3) is protected by a protective resin (5) provided by a polyimide resin. The semiconductor chip (3) is held by the protective resin (5) with respect to the insulated substrate (2). Preferably, an adhesive layer (4) is provided between the semiconductor chip (3) and the insulated substrate (2). The adhesive layer (4) is also provided by a polyimide resin.

REFERENCES:
patent: 5450283 (1995-09-01), Lin et al.
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 5821320 (1998-10-01), Maeda et al.
patent: 5864178 (1999-01-01), Yamada et al.
patent: 5937320 (1999-08-01), Andricacos et al.
patent: 10-107086 (1998-04-01), None
patent: 10-199936 (1998-07-01), None
patent: 11-026652 (1999-01-01), None
patent: 11-220077 (1999-08-01), None
patent: 2001-060641 (2001-03-01), None
English language Abstracts of JP 10-107086 and 2001-060641.
Copy of Japanese Office Action dated Jun. 27, 2006 citing the above references.
Article entitled “Electronic Packaging And Interconnection Handbook” by Charles A. Harper, published in Technology Seminars, Inc., Lutherville, Maryland, ISBN 0-07-026684-0, 1991.

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