Mounting structure of high frequency apparatus

Details Mounting structure of high frequency apparatus Mounting structure of high frequency apparatus

2008-04-22

2008-04-22

Duverne, J. F. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Within distinct housing spaced from panel circuit arrangement

Reexamination Certificate

active

07361030

ABSTRACT:
In a mounting structure of a high frequency apparatus, in an outer circumference around terminals connected to a mother board, an enclosed portion, which is brought into contact with the mother board and is enclosed by a ring-shaped convex portion provided in a cover, or an enclosed portion, which is brought into contact with the mother board and is enclosed in a ring shape by a convex portion provided in the cover and extending portions from the frame, are provided. The terminals are electrically shielded by the enclosed portion. Therefore, when a high frequency apparatus is mounted on the mother board, interfering electric waves are prevented from entering into the terminals, and thus favorable performance is obtained.

REFERENCES:
patent: 4325103 (1982-04-01), Ito et al.
patent: 5159537 (1992-10-01), Okano
patent: 6011700 (2000-01-01), Matsuzaki
patent: 6118672 (2000-09-01), Yamauchi et al.
patent: 6388892 (2002-05-01), Maeda
patent: 2908967 (1999-04-01), None

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