Mounting structure of component of lighting device and...

Details Mounting structure of component of lighting device and... Mounting structure of component of lighting device and...

2009-12-11

2011-11-08

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S121000, C438S022000, C438S026000, C257S088000, C257S733000, C257S783000

Reexamination Certificate

active

08053282

ABSTRACT:
Disclosed is a structure for mounting a component to a lighting device, including at least one lighting-device base, at least one metal film, and a lighting array chip. The lighting-device base has a surface to which a first layer of metal bonding agent is applied. The metal film has a surface attached to the first metal bonding agent layer on the surface of the lighting-device base. The lighting array chip has a bottom surface to which a second layer of metal bonding agent is applied. The second metal bonding agent layer is further attached to an opposite surface of the metal film so as to securely mount the lighting array chip to the surface of the lighting-device base. A mounting method is also provided, including the steps of applying a metal bonding agent to a surface of a lighting-device base; connecting the lighting-device base to a positive electrode of a power source; connecting a metal film to a negative electrode of the power source; applying a metal bonding agent to a lighting array chip; bonding the lighting array chip to the metal film; and hot-pressing to bond the lighting array chip to the lighting-device base, so that the lighting array chip is securely mounted to the surface of the lighting-device base by means of thermal fusion caused between the negative and positive polarities of the power source applied to the metal film and the lighting-device base.

REFERENCES:
patent: 5338704 (1994-08-01), Imai et al.
patent: 2009/0311815 (2009-12-01), Miyachi et al.

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