Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2005-04-05
2009-08-25
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S780000, C257S782000, C257SE23021, C257SE23069, C361S760000, C361S764000
Reexamination Certificate
active
07579693
ABSTRACT:
A ball grid array is mounted on a wiring board in a rectangular shape provided with screw insertion holes and fixed with screws to a mounting member at four points. Solder banks are formed around the screw insertion holes and pressed contact with a ground connecting face on the mounting member. The screw insertion holes are located in corners of an imaginary rectangular outline imagined on a board surface of the wiring board. Two of the holes diagonally positioned on the outline are located in one of corners and at an inward position of the wiring board, while the remaining two are located at intermediate parts of two sides embracing the corner. The wiring board is divided into a rectangular first zone surrounded by the four points and an L-shape second zone. The ball grid array is mounted on an intersecting area between vertical and transverse areas defining the L-shape.
REFERENCES:
patent: 5894408 (1999-04-01), Stark et al.
patent: 5930115 (1999-07-01), Tracy et al.
patent: 5949238 (1999-09-01), Marquis
patent: 6536448 (2003-03-01), McDevitt et al.
patent: 10-256693 (1998-09-01), None
patent: 11-163043 (1999-06-01), None
patent: 2000-58703 (2000-02-01), None
patent: 2001-326428 (2001-11-01), None
patent: 2002-217502 (2002-08-01), None
patent: 2003-46273 (2003-02-01), None
Patent Abstracts of Japan, Publication No. 2000-058703, Publication Date Feb. 25, 2000, 1 page.
Patent Abstracts of Japan, Publication No. 11-163043, Publication Date Jun. 18, 1999, 1 page.
Patent Abstracts of Japan, Publication No. 10-256693, Publication Date Sep. 25, 1998, 1 page.
Japanese Office Action for Japanese Application 2004-110933 mailed on Feb. 5, 2007 (4 pages).
Chambliss Alonzo
Funai Electric Co. Ltd.
Osha • Liang LLP
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