Mounting structure for surface mounted type component with proje

Details Mounting structure for surface mounted type component with proje Mounting structure for surface mounted type component with proje

1988-07-13

1989-03-21

Evall, Jr., Roy N.

Electricity: electrical systems and devices

Miscellaneous

H05K 710

Patent

active

048149446

ABSTRACT:
In this mounting structure and method for a surface mounted type electronic component, the component has at least one terminal which protrudes from its bottom surface and which terminates in a foot portion for being soldered to a printed circuit board. Also, a projection extends from this bottom surface of the electronic component for a distance somewhat less than the amounty by which the terminal projects from it. This projection is provisionally secured by adhesive to the printed circuit board with the foot portion of the terminal overlaying that circuit portion to which it is to be soldered, and then subsequently this terminal foot portion is soldered to this circuit portion. Thereby, during the soldering process, there is no risk of the terminal foot portion becoming displaced from the circuit portion and thus badly soldered thereto, because of the locating action of the adhered projection. The projection may extend from a central portion of the bottom surface of the component, or may be provided in plurality as extending from central portions of edges of said bottom surface. And the end of the projection may be roughened.

REFERENCES:
patent: 3649950 (1972-03-01), Gluntz
patent: 3684817 (1972-08-01), Card, Jr. et al.
patent: 4339785 (1982-07-01), Ohsawa
Hitachi Seisakusho K. K., Japanese Patent Abstract No. 60-68641, vol. 9, No. 204, 4/19/85.
Mitsubishi Denki K. K., Japanese Patent Abstract No. 60-12716, vol. 9, No. 126, 5/31/85.
Rice, "VLSI Packaging Environment", Digest of Papers, Feb. 23-26, 1981.

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