Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2007-09-04
2007-09-04
Ha, Nathan W. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Reexamination Certificate
active
10957739
ABSTRACT:
To arrange semiconductor parts such as chip resistors and the like between a BGA and a mounting substrate, an interposes is disposed between the BGA and the mounting substrate for mounting the BGA thereon. The interposer serves to maintain the distance between the mounting substrate and the BGA to be just as large as or larger than the thickness of the semiconductor parts and to electrically connect solder balls of the BGA and electrically conductive patterns of the mounting substrate. The semiconductor parts are mounted on the mounting substrate before fixing the BGA22to the interposer.
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Nakamura Atsushi
Tsukui Seiichiro
Tsuneda Kensuke
Elpida Memory Inc.
Ha Nathan W.
McGinn IP Law Group PLLC
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