Mounting structure for semiconductor device having low thermal r

Details Mounting structure for semiconductor device having low thermal r Mounting structure for semiconductor device having low thermal r

1994-06-23

1997-02-11

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257711, 257712, 361808, H05K 720

Patent

active

056027206

ABSTRACT:
A structure for mounting a semiconductor device includes a ceramic plate having a thermal conductivity equal to or higher than 120 W/mK on one surface of which the semiconductor device is mounted, a heat sink joined to another surface of the ceramic plate formed of a copper or copper based alloy plate having a thermal conductivity equal to or higher than 300 W/mK, and a base member formed of a metal or an alloy having a thermal conductivity equal to or higher than 100 W/mK on which the heat sink is mounted.

REFERENCES:
patent: 3439255 (1969-04-01), Carnes et al.
patent: 4788627 (1988-11-01), Ehlert et al.

Affiliated with

Also associated with

Rating

Mounting structure for semiconductor device having low thermal r does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mounting structure for semiconductor device having low thermal r, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting structure for semiconductor device having low thermal r will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-347065