Mounting structure for one or more semiconductor devices

Details Mounting structure for one or more semiconductor devices Mounting structure for one or more semiconductor devices

1998-07-08

1999-10-26

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361803, 257723, 257778, H05K 111, H05K 706, H01L 23488

Patent

active

059739304

ABSTRACT:
A mounting structure wherein, in a semiconductor package mounting position on a wiring board, a package bearing substrate whose external size is substantially equal to or larger than that of the semiconductor package and which has on its upper surface pads for connection to a semiconductor package and on its lower surface pads for connection to the wiring board is arranged, the pads on the wiring board and those on the lower surface of the package bearing substrate are connected by soldering, and the soldered junction is filled and fixed with an under-fill.

REFERENCES:
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 5375042 (1994-12-01), Arima et al.
patent: 5477933 (1995-12-01), Nguyen
patent: 5535101 (1996-07-01), Miles et al.

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