Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-01-05
2002-04-09
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S719000, C361S704000
Reexamination Certificate
active
06370026
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to mounting structures for mounting power elements to a heat dissipation member, and more particularly to the mounting structures of a type that is suitable for a brushless motor.
2. Description of the Prior Art
As is known, a power element is a control element that controls voltage and/or current and generates a certain heat under operation. For effectively removing such heat, various mounting structures have been proposed and put into practical use. One of them is disclosed in Laid-open Japanese Patent Application 2000-32729, whose essential portion is shown in
FIG. 20
of the accompanying drawings. In this mounting structure, heat generated from the power element is transferred to a heat dissipation member through a heat sink. In the drawing, denoted by numeral
105
is a power element. The power element
105
contacts to a leg portion
107
of a heat sink
101
. The heat sink
101
is formed with a plurality of heat dissipation fins
103
which serve as the heat dissipation member. Terminals
109
of the power element
105
are soldered to a circuit on a circuit board
111
. The leg portion
107
of the heat sink
101
is connected to the circuit board
111
by means of a bolt
113
. As shown, the power element
105
is pressed against a surface
115
of the leg portion
107
by means of a spring member
117
. Thus, under operation, heat generated from the power element
105
is transferred to the heat dissipation fins
103
through the leg portion
107
.
However, in this conventional power element mounting structure, provision of the leg portion
107
causes increase in length of a so-called heat travelling path and thus makes the heat dissipation effect poor. Furthermore, in this mounting structure, the leg portion
107
needs a certain strength and thus a larger size because it has to hold the power element
105
and has to serve as a good heat transferring means. Of course, in this case, the power element mounting structure becomes bulky, heavy and costly.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a structure for mounting power elements to a heat dissipation member, which is free of the above-mentioned drawbacks.
According to the present invention, there is provided a structure which comprises a circuit board; a spring plate of metal, the spring plate being resiliently mounted, through a first mounting structure, on the circuit board keeping a given space therebetween; a plurality of power elements disposed on the spring plate to form a semi-assembled unit; a heat dissipation member of metal having a plurality of heat dissipation fins on an outer surface thereof, the heat dissipation member being mounted, through a second mounting structure, on the semi-assembled unit in such a manner that an inner surface thereof faces toward the power elements; and a plurality of spring pieces defined by the spring plate, the spring pieces being arranged to press the power elements against the inner surface of the heat dissipation member.
REFERENCES:
patent: 4575038 (1986-03-01), Moore
patent: 5130888 (1992-07-01), Moore
patent: 6081424 (2000-06-01), Mach et al.
patent: 6229706 (2001-05-01), Cook et al.
patent: 6243264 (2001-06-01), Bollesen et al.
patent: 6249436 (2001-06-01), Bollesen
patent: 6304449 (2001-10-01), Zhang
Oba Takeshi
Ohira Shigenori
Sano Narihito
Sunaga Hideki
Yamada Kazunori
Calsonic Kansei Corporation
Tolin Gerald
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