Mounting structure for mounting a piezoelectric element

Details Mounting structure for mounting a piezoelectric element Mounting structure for mounting a piezoelectric element

1995-06-30

1997-02-18

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361768, 361771, 310348, 310349, 310313R, 310368, H05K 702, H01L 4104

Patent

active

056046677

ABSTRACT:
An opening is formed in a region of a circuit board opposite a vibration region E of a piezoelectric element. The piezoelectric element is mounted to the circuit board, and electrical connections extend between and support the piezoelectric element from the circuit board by a solder. The soldered connection portions are surrounded by a bonding agent. An opening in the circuit board prevents any excess bonding agent from invading the vibration region E of the piezoelectric element, and the bonding agent assists in dispersing stresses exerted on the circuit board thereby minimizing the stresses transferred to the piezoelectric element.

REFERENCES:
patent: 3303393 (1967-02-01), Hymes et al.
patent: 4141543 (1979-04-01), Hayakawa et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4749120 (1988-06-01), Hatada et al.
patent: 5012969 (1991-05-01), Hatada et al.
patent: 5235135 (1993-08-01), Knecht et al.
patent: 5291460 (1994-03-01), Harada et al.

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