Mounting structure for electronic part

Details Mounting structure for electronic part Mounting structure for electronic part

1998-06-08

2000-11-21

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361783, 257696, 257723, 257726, 29832, H05K 118, H01L 2348

Patent

active

061512206

ABSTRACT:
Leads 106 provided at an electronic part connectors 110 of an electronic part 100, which are electrically connected to a surface of a substrate 120 are structured in such a manner that they are directly connected to a substrate connector formed at the surface of the substrate 120 through a pressing force or a bonding force applied to the electronic part 100. This lead structure makes it possible to preclude the use of connectors including additional members such as contact pins, to achieve a reduction in the length of the communicating path of the electrical signals, and in addition, since electrical connection is achieved at one location, i.e., between the leads 106 and the substrate connector at the substrate 120, the contact resistance is minimized.

REFERENCES:
patent: 3873173 (1975-03-01), Anhalt
patent: 4595794 (1986-06-01), Wasserman
patent: 4692790 (1987-09-01), Oyamada
patent: 4895523 (1990-01-01), Morrison et al.
patent: 5395253 (1995-03-01), Crumly
patent: 5420461 (1995-05-01), Mallik et al.
patent: 5433631 (1995-07-01), Beaman et al.
patent: 5619067 (1997-04-01), Sua et al.

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