Mounting structure for electronic components

Details Mounting structure for electronic components Mounting structure for electronic components

2008-03-25

2008-03-25

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C361S772000

Reexamination Certificate

active

07348497

ABSTRACT:
A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.

REFERENCES:
patent: 5414220 (1995-05-01), Hanato et al.
patent: 5616888 (1997-04-01), McLaughlin et al.
patent: 6310780 (2001-10-01), Tamura et al.
patent: 6807021 (2004-10-01), Kurashima
patent: 6977423 (2005-12-01), Kohmoto et al.
patent: 2003-209294 (2003-07-01), None
patent: 2004-071890 (2004-03-01), None

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