Mounting structure for electronic component

Details Mounting structure for electronic component Mounting structure for electronic component

2007-05-23

2011-10-18

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S767000

Reexamination Certificate

active

08039758

ABSTRACT:
A mounting structure is provided in which outer electrodes of an electronic component are soldered on lands provided on a circuit board. Two of the lands on which two of the outer electrodes disposed along a diagonal of a principal surface of the electronic component are soldered, are configured such that inner vertexes defined at opposite ends of a minimum distance between the lands are aligned with inner vertexes defined at opposite ends of a minimum distance between the outer electrodes. That is, sides of the outer electrodes are aligned with outer edges of the lands. Accordingly, only one positional relationship is permitted between the electronic component and the mounting surface, the positional relationship causing a total area of the outer electrodes facing the lands to be maximized.

REFERENCES:
patent: 4870225 (1989-09-01), Anao et al.
patent: 6566611 (2003-05-01), Kockanowski et al.
patent: 7280370 (2007-10-01), Chan
patent: 2003/0173577 (2003-09-01), Yoon et al.
patent: 2003/0184986 (2003-10-01), Soga et al.
patent: 38 00 116 (1988-07-01), None
patent: 103 01 512 (2003-10-01), None
patent: 62-136096 (1987-06-01), None
patent: 01-245591 (1989-09-01), None
patent: 02-065293 (1990-03-01), None
patent: 04-217388 (1992-08-01), None
patent: 4-121779 (1992-10-01), None
patent: 2000-299548 (2000-10-01), None
Official communication issued in counterpart German Application No. 11 2006 000 153.1, mailed on Jan. 15, 2009.
Official Communication for PCT Application No. PCT/JP2006/305944; mailed on Jun. 20, 2006.

Affiliated with

Also associated with

Rating

Mounting structure for electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mounting structure for electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting structure for electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4278721