Mounting structure for electronic component

Details Mounting structure for electronic component Mounting structure for electronic component

1994-12-22

1996-07-02

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

257693, 257697, 257728, 333 24C, H01P 500, H01L 2348

Patent

active

055326587

ABSTRACT:
An electronic component which is employed in the frequency range in the microwave band or above is mounted on a circuit board. The circuit board comprises two linear transmission line members, a ground electrode, and an electric insulating substrate provided with the transmission line members and the ground electrode on its major surface. The electronic component comprises external electrodes which are formed on its side surfaces. Holding patches which are formed on the lower surface of the electronic component are bonded to the ground electrode by solder members, thereby fixing the electronic component to the circuit board. At this time, small clearances are defined between the electronic component and the circuit board through the solder members, whereby the external electrodes are electromagnetically coupled with the transmission line members and the ground electrode through the clearances respectively. Thus, it is possible to obtain a mounting structure for an electronic component, which can suppress development of unnecessary inductance components.

REFERENCES:
patent: 4600907 (1986-07-01), Grellman et al.
patent: 4716389 (1987-12-01), Gawronski et al.
patent: 4816789 (1989-03-01), Mars
patent: 5138436 (1992-08-01), Koepf

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